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Thermal
24 Thermal
This section describes the thermal specifications of the MPC8309.
24.1
Thermal characteristics
The following table provides the package thermal characteristics for the 369, 19 × 19 mm MAPBGA of
the MPC8309.
Table 64. Package thermal characteristics for MAPBGA
Characteristic
Junction-to-ambient natural convection
Junction-to-ambient natural convection
Junction-to-ambient (@200 ft/min)
Junction-to-ambient (@200 ft/min)
Junction-to-board
Junction-to-case
Junction-to-package top
Board type
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
—
—
Natural convection
Symbol
R θ JA
R θ JA
R θ JMA
R θ JMA
R θ JB
R θ JC
Ψ JT
Value
40
25
33
22
15
9
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 2, 3
1, 3
1, 3
4
5
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
24.1.1
Thermal management information
For the following sections, P D = (V DD × I DD ) + P I/O , where P I/O is the power dissipation of the I/O
drivers.
24.1.2
Estimation of junction temperature with junction-to-ambient
thermal resistance
An estimation of the chip junction temperature, T J , can be obtained from the equation:
T J = T A + (R θ J A × P D )
Eqn. 1
where,
T J = junction temperature ( ° C)
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
72
Freescale Semiconductor
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